Stephen Lawson, IT World, The Moore’s Law blowout sale is ending, Broadcom’s CTO says, here.
“The cost curves are kind of getting flat,” Samueli told reporters at an evening Broadcom event at the Tank18 wine bar in San Francisco’s trendy South of Market district. Instead of getting more speed, less power consumption and lower cost with each generation, chip makers now have to choose two out of three.
He pointed to new techniques such as High-K Metal Gate and FinFET, which have been used in recent years to achieve new so-called process nodes. The most advanced process node on the market, defined by the size of the features on a chip, is due to reach 14 nanometers next year. At levels like that, chip makers need more than traditional manufacturing techniques to achieve the high density, Samueli said. The more dense chips get, the more expensive it will be to make them, he said.
Process nodes themselves still have room to advance, but they may also be headed for a wall in about 15 years, Samueli said. After another three generations or so, chips will probably reach 5nm, and at that point there will be only 10 atoms from the beginning to the end of each transistor gate, he said. Beyond that, further advances may be impossible.
“You can’t build a transistor with one atom,” Samueli said. There’s no obvious path forward at that point, either. “As of yet, we have not seen a viable replacement for the CMOS transistor as we’ve known it for the last 50 years.”